Mushkin Announces New Heatsink Design for High Performance PC’s

Denver, CO, July 28, 2005- Mushkin announces a new heatsink for high performance DRAM memory modules. The new heatsink is designed to handle the increased thermal demands of today’s high performance PCs. The new design delivers superior thermal conductivity and dissipation. It’s sleek and aero-efficient design provides 58% more surface area than Mushkin’s previous heatsink.

“By opening up the design we improved airflow in and around the memory module and increased the surface area,” says Brian Flood, head of Mushkin’s product development. “It’s far superior in performance and appearance.”

Additionally, the new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material. Mushkin is using the new heatsink on all its performance DDR and DDR2 products, such as the Redline series products that benefit the most from the new design, like the popular Redline and Xtreme series products. Expect to see the new heatsink on all Mushkin performance DDR products.

Recovered from an Internet Archive snapshot of the InsaneTek front page.