Breakthrough in Stacked DRAM Made by Invensas

Written by John Ponio    Thursday, 08 September 2011 15:55

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A relatively-unknown company called Invensas has found a way to stack DRAM chips on top of each other. You might be asking why this is news worth reading about. Well, if you think about it, chips on top of each other are much closer than chips laid out on a stick of RAM one by one. Shorter distance means shorter wires, which means less electricity needs to be used as well as faster speeds. It also means DRAM will take up less physical space, which is vital in today's every-shrinking technology. This technology is called multi-die- face-down (xFD) packaging. Simon McElrea, president of Invensas Corporation, said, "We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices. xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption." While the amount of energy this technology saves per operation is miniscule, if you multiply it by the number of operations something such as a data center will have, it's quite a lot. You can read more about it here, and see pictures of it here. Invensas is planning on showing off the technology at the Intel Developer Conference (IDF) on September 13-15, 2011. It may be quite expensive at first, but apparently any regular DRAM fabrication unit can fabricate it stacked, so prices shouldn't stay high for very long.

 

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