Page 1 of 6Introduction
Is it just me, or is OCZ always releasing some crazy overclocking memory? I remember when they announced the Gold PC3200 VX and everyone went nuts trying to figure out what chips were used. I had an idea that it would be Winbond, but since Winbond officially announced they were leaving the DRAM market, I threw that guess out the window. It turned out that Winbond chips really were used underneath those shiny gold heatspreaders. Although the Gold PC3200 VX is rated to run 2-3-3-8 with 2.6v, many overclockers have found that it was able to scale rather nicely with increased voltage. With the DFI Ultra-D motherboard, many have pumped as much as 3.6v into those sticks and hit beyond 250MHZ. What's really interesting is that the die inside the IC's are based on the same processing as the old CH5 chips. These new ones are called Winbond UTT CH5. We know that the Gold VX are great overclockers if you can supply the voltage, so what's the point of the new release of the Gold PC3200?
The newly released Gold PC3200 also features Winbond chips and is rated at a low 2-2-2-5 at 200MHZ. The difference between the VX and the non-VX is the kind of Winbond chips used. These sticks feature the new BH5 chips, called Winbond UTT BH5. One reason why OCZ recommended 3.2v on the VX to run timings of 2-2-2 is because CH5 chips needed higher voltage than BH5's to achieve the same results. These new BH5's don't actually need as much voltage just to run low latencies, but we all know that Winbond chips just love high voltage. Equipped with the high voltage pumping DFI Ultra-D, these pretty OCZ Gold PC3200 sticks will go through one wild rollercoaster ride.