Page 1 of 6Introduction
Before I begin, I must be honest and say that I've never been a big fan of GeIL memory. I remember when GeIL first introduced their low latency PC3200 memory about 2 and a half years ago. The use of copper heatspreaders made me skip with joy. Being new to the computer industry, I had doubts, but reviews showed the memory worthy of my dollars. I immediately bought a few sticks to play with. I obtained their Platinum PC3200, Platinum PC3500, and Platinum PC3700. They were all big disappointments to me. Why? None of them overclocked well. The Platinum PC3500 couldn't even run the rated speeds and timings. The Platinum PC3700 was half-decent. It was around the time Intel released the Northwood 2.4C, and the PC3700 allowed me to run 300FSB with a 5:4 divider, resulting in 240MHZ. Since then, I have not touched GeIL memory. Many continue to recommend the memory with good results, but I did not want to give them another try.
My opinions began to change when we received our sample of the GeIL Ultra-X PC3200. The memory was based on Samsung TCCD IC's and won our Must-Have award. I was rather impressed by the performance and the overclocking headroom. I still wasn't entirely persuaded, because all memory with TCCD and Brainpower PCB seem to perform well.
Samsung discontinued the TCCD chips in February. Many memory manufacturers were forced to find alternatives for low latency operation. Luckily, Winbond chips are being fabricated again under the same process as the renowned BH5, allowing low latency operations of 2-2-2 at 200MHZ. They also give the DFI Ultra-D users a chance to really pump some juice to the memory to see just how high the memory can reach. That's what we're going to do with GeIL's Ultra-X PC3200 based on the Winbond chips. Paired with the DFI Ultra-D motherboard and some high voltage, we'll see if the results can change my opinion of their memory.